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                您當前的位置:  產品與應用
                • KrF深紫外光刻膠系列

                  Kind       型號Performance                    性  能Application                  應  用
                  DK1081R:0.18μm,Thickness   range:0.4um-0.8μmAA/Poly/CT
                  DK1080R:0.25μm,Thickness   range:0.55μm-1.0μmImplant/AA/CT
                  DK1088R:0.25μm,Thickness   range:0.8μm-1.4μmTV/TM/Implant
                  DK1089R:0.25μm,Thickness   range:0.8μm-1.4μmTV/TM/Implant
                  DK1087R:1μm,Thickness range:3-4μmSpecial application/ PAD
                  DK2060R:0.25μm,Thickness:0.55-0.8μmContact/Hole
                  DK3030R:0.25μm,Thickness:0.6-0.8μmAA/Metal/Contact/Hole
                  DKN1100Krf Negative PR   R:0.20μm,Thickness:0.4-0.8μmSAB/Implant


                • i /g line正膠系列

                  Kind         型號Performance                    性  能Application                  應  用
                  C7600R:0.30μm,Thickness   range:7000A-12000A0.3um process
                  C7500R:0.4μm,Thickness   range:7000A-12000A0.4μm process
                  C7510R:0.5μm,Thickness   range:19000A-36000A0.5um process
                  C7310R:0.45μm,Thickness:13000A-15000A  0.5μm process
                  C8315R:0.65μm,High heat resistance0.65μm process
                  C8325R:0.9μm,Thickness:14000A-23000A0.9μm process
                  C8350R:1.2μm,Thickness:20000A-35000AMetal/Passivation
                  C5315R:0.65μm,Thickness:10000A-17000A0.65μm process
                  EP3200AR:1.0μm,Thickness:20000-35000ALED positive   resist


                • Thick Film正膠系列

                  Kind        型號Performance                    性  能Application                  應  用
                  C6111A1g-i line thick   resist,Thickness:30000-50000AImplant/Passivation
                  C6350Ag-i line thick   resist,Thickness:40000-80000APassivation layer
                  C6230g-i line thick   resist,Thickness:40000-80000AImplant/Passivation
                  C6124A1g-i line thick   resist,Thickness:<11μmLED/Packaging
                  CP4800/CP4900For KOH and TMAH base developerPackaging/IGBT
                  C9005ICA PR,R:0.8μm,Thickness:3-8μmRDL/TSV


                • lift off負膠系列

                  Kind        型號Performance                    性  能Application                  應  用
                  EN3120A1R:2μm@4μm,Thickness:4.5-9.5μm,
                      High heat resistance
                  IC/LED
                  E3130ALift off negative resist,High   resolutionIC/LED
                  E3260A2/SR:5μm@8μm,<100mj/cm2,Thickness:6-12μmIC/LED
                  E3502R:0.6μm@2.4μm,Thickness:2-4μm,Easy   stripIC/LED
                  E3510R:6μm@14μm,Thickness:5-20μm,Easy   stripIC/LED
                  E3175/BR:2.0μm@3.8μm,Small undercut,Thickness:2-4μmIC/LED


                • BP正膠系列

                  Kind        型號Performance                    性  能Application                  應  用
                  BP218通用型正膠IC/MEMS
                  BP212通用型正膠IC/MEMS


                • 分立器件負膠系列

                  Kind        型號Performance                    性  能Application                  應  用
                  BN310高分辨負膠分立器件
                  BN303通用型負膠分立器件
                  BN308高抗蝕負膠分立器件


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